Shenzhen Leadsintec Technology Co., Ltd
Shenzhen Leadsintec Technology Co., Ltd
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Halogen Free 2 Layer Pcb Board High Tg FR4 Fast PCB Assembly Immersion Gold
2 Layer High TG Medical PCB Assembly FR4 Circuit Flexible Rigid Bare Board SMT PCBA
PCB&PCBA Capacity:
| 1 | Material | FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material,PI Material,BT Material,PPO,PPE etc. |
| 2 | Board thickness | Mass production:394mil(10mm) Samples:17.5mm |
| 3 | Surface finish | HASL,Immersion Gold,Immersion Tin,OSP,ENIG+OSP,Immersion Silver,ENEPIG,Gold Finger |
| 4 | PCB Max panel size | 1150mm × 560mm |
| 5 | Layer | Mass production:2~58 layers/Pilot run: 64 layers,Flexible PCB: 1-12 Layers |
| 6 | Min hole size | Mechanical drill:0.15mm Laser drill:3mil(0.075mm) |
| 7 | PCBA QC | X-ray,AOI Test,Functional Test,QC,QA,QE |
| 8 | Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Back drilling, Resistance control, Impedance Requirement. |
| 9 | Our service | PCB,Turnkey PCBA,Housing, PCB Assembly,Component sourcing,PCB manufacturing |
| 10 | SMT Capacity | 700Million Points/Day,BGA,01005 |
| 11 | DIP Capacity | 0.5Million Points/Day |
| 12 | Certificate | RoHS/ISO9001/TS16949/UL/ISO14001/ISO13485 |
1, Gerber files and BOM provided by the customer
2, Fine-pitch component and BGA placement
3, A good soldering workmanship and reliable quality
4, Flexible production capacity for high-mix model and low to medium order
5, Authorized components source, comprehensive supplier network support
Our capacity and service:
1. PCB fabrication from 1-32 layers. (single side, double side, multi-layer, HDI board, bury& blind holes board, etc)
2. Material procurement and management
3. Quick-turn PCBA Prototype and NPI (new product introduction)
4. PCBA and through-hole assembly
5. Complete Unit assembly (Box building includes the plastic, screen, metal enclosure, membrane, coils, wire harness, etc.)
6. Small volume is accepted and High-mix models solutions
7. AOI, In-circuit test, BGA placement, Function testing
8. Engineering support including end of life and obsolete component replacement and design support for circuit, metal, plastic casing, and packaging
